微电子封装▓热界面材料研究综述

杨宇军; 李逵; 石钰林; 焦斌斌; 张志祥; 匡乃亮

doi:10.19304/J.ISSN1000-7180.2022.0684

微电子封装热界面材料研究综述

doi: 10.19304/J.ISSN1000-7180.2022.0684

1.
西安微电子技术研究所, 陕西西安 710000
2.
中国科学院微电子研∩究所, 北京 100029

详细信息

作者简介:
杨宇军：男,（1972-）,博士,研究员,博士生导▓师. 研究方向为微系统环境适应性

石钰林：男,（1998-）,硕士研究生. 研究方◤向为低结壳热阻芯片关键封装技术

焦斌斌：男,（1981-）,博士,研究员,博士生导师. 研究方向为MEMS与微系统技术

张志祥：男,（1994-）,硕士研究生,工程师. 研究方向为微系统散热管理技术

匡乃亮：男,（1982-）,硕士,高级◣工程师. 研究方向为微系统集成技术

通讯作者:
男,（1987-）,硕士,高级工↘程师. 研究方向为微系统散热和结构工艺可靠性.E-mail： likui285@sina.com

中图分类号: TN47
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出版历程
- 收稿日期: 2022-10-30
- 修回日期: 2022-11-26
- 网络出版日期: 2023-01-18

Review of thermal interface materials for microelectronic packaging

1.
Xi'an Institute of Microelectronics Technology, Xi'an 710000, China
2.
Institute of Microelectronics, Chinese Academy of Sciences, Beijing 100029, China

摘要

摘要:
随着半导体器件向着微型化、髙度集成化及高功率密度方向发展,其发热量急剧增大,热失效已经成为阻碍微电子封装器件性能和寿命的首要问题. 高性能的热管理材料能有效提高微电子封装内部元器件散热能力,其中封装结构散热路径上的热界面材料（Thermal Interface Material,TIM）便是热管理中至关重要的环节. 通过热界面材料填充器件热源和散热单元之间的空隙,可以大幅度降低接触热阻, 增加热量的传递效率. 对微电子封装而言,高性能的热界面材料不仅需要高的导热系数以降低封装热阻,还需具备一定的压缩性以弥补封装的装配偏差,然而通常很难兼顾上述两种特性. 本文重点关注微电子封装中热界面材料,系统地梳理了目前热界面材料的常见类型、应用存在问题、关注研究热点和国内外发展现状.
- 微电子封装 /
- 热管理 /
- 热界面材料 /
- 导热系数 /
- 热阻
Abstract:
With the development of semiconductor devices toward miniaturization, high integration and high power density, the calorific value increases sharply. Thermal failure becomes the primary problem hindering the performance and life of microelectronic devices. High-performance thermal management materials can effectively help microelectronic components to dissipate heat. The thermal interface material (TIM) on the heat dissipation path of packaging structure is a crucial part in the thermal management. By filling the gap between the heat source and the cooling unit, TIM can reduce the contact thermal resistance and improve heat transfer efficiency. For microelectronic packaging, high-performance thermal interface materials not only need high thermal conductivity to reduce the thermal resistance of packaging, but also need a certain compressibility to make up for the assembly deviation of packaging. However, it is often difficult to take into account the above two characteristics. This paper focuses on the thermal interface material in microelectronics packaging, systematically summarizes the common types of thermal interface materials, existing problems in application, research hotspots and development status at home and abroad.
- Microelectronic packaging /
- thermal management /
- thermal interface materials /
- heat conductivity /
- thermal resistance

HTML全文

图 1 实际热界面状态及热流方向上热阻示意图

Figure 1. Schematic diagram of the real thermal interface status and thermal resistance components

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图 2 典型微电子封装器件散热路径

Figure 2. Heat dissipation path of microelectronic packaging components

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图 3 R_tot随 BLT线性变化曲线^[7]

Figure 3. Plots of R_tot versus BLT for different TIMs

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图 4 稳态法测试系统框架图^[61]

Figure 4. Steady-state test frame diagram system

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图 5 瞬态平面热源法测试结构

Figure 5. The test structure of transient plane heat source method

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表 1 常见TIM类型⌒　和典型特性^[11-23]

Table 1. Common TIM types and typical characteristics

Type	Thermal conductivity/ Wm^?1 K^?1	BLT/pm	Thermal interface resistance /Km² W^?1	Pump-out	Absorbs stress	Reusable	Replaceability
Thermal grease	0.4~4	20-150	10~200	Yes	Well	No	Medium
Thermal pad	0.8~3	200~1000	100~300	No	Well	Yes	Excellent
Phase change material	0.7~1.5	20~150	30~70	Yes	Well	No	Medium
Thermal gel	2~5	75-250	40~80	No	Medium	No	Medium
Thermally conductive adhesive	1~2	50~200	15~100	No	Medium	No	Poor
Solder	20~80	25-200	<5	No	Poorly	No	Poor

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